TBU-PK075-100-WH【PDF 5/7 页】DUAL 80OHM BI-DIRECTIONAL TBU

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Sheet目录1247

1页 2页 3页 4页 [5页]6页 7页

TBU-PK Series - TBU ? High-Speed Protectors

Product Dimensions

0.70

(.028)

0.825

(.032)

0.40

(.016)

0.825

(.032)

0.725

(.029)

1.275

(.050)

0.30

(.012)

6.50

(.256)

0.85 ± 0.05

(.033 ± .002)

1.335

0.30

(.012)

1.15

(.045)

1.20

(.047)

1.35

(.053)

1.275

(.053)

(.050)

0.73

(.029)

0.85

(.033)

0.85

(.033)

4.00

(.157)

1.335

1.35

(.053)

0.85

(.033)

1.20

(.047)

0.85

(.033)

1.275

(.010)

PIN 1 & BACKSIDE CHAMFER

0.80 - 0.95

(.031 - .037)

(.053)

1.25

(.049)

0.75

(.050)

0.25

C PIN 1

0.90

(.030)

0.70

(.028)

1.30

(.051)

0.85

(.033)

0.85

(.033)

(.035)

0.00 - 0.05

(.000 - .002)

DIMENSIONS:

MM

(INCHES)

0.75

(.030)

0.40

(.016)

0.75

(.030)

Recommended Pad Layout

TBU ? High-Speed Protectors have a 100 % matte-tin termination

?nish. For improved thermal dissipation, the recommended layout

uses PCB copper areas which extend beyond the exposed solder

pad. The exposed solder pads should be de?ned by a solder mask

which matches the pad layout of the TBU ? device in size and spac-

ing. It is recommended that they should be the same dimension as

the TBU ? pads but if smaller solder pads are used, they should be

centered on the TBU ? package terminal pads and not more than

0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.

Solder pad areas should not be larger than the TBU ? pad sizes

stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil

opening size 0.025 mm (0.0010 in.) less than the solder pad

size. Extended copper areas beyond the solder pad signi?cantly

improve the junction to ambient thermal resistance, resulting in

operation at lower junction temperatures with a corresponding

bene?t of reliability. All pads should soldered to the PCB, includ-

ing pads marked as NC or NU but no electrical connection should

be made to these pads. For minimum parasitic capacitance, it is

recommended that signal, ground or power signals are not routed

beneath any pad.

to ensure adequate clearance is maintained. The recommended

Thermal Resistance vs Additional PCB Cu Area

120

Power in One Side of TBU ? Device

4

3

2

1

100

Total Power in Both Sides of TBU ? Device

80

5

6

7

8

60

40

Dark grey areas show added PCB copper area for better

thermal resistance.

20

0

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

Speci?cations are subject to change without notice.

Customers should verify actual device performance in their speci?c applications.

Added Cu Area (Sq. In.)

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